Wet Process Section

This is one of the major processing stages in PCB production flow and is involved with strengthening the copper conductors in the circuit traces, etching away the unwanted copper, and preventing the surface of the copper traces from oxidation by means of applying surface treatment techniques such as HAL/entek coating with OSP. The main production lines are

• Automated line for copper immersion
• Automated line for copper plating
• Film developer
• Double-sided brushing machines
• Alkaline double-sided etching machines
• Entek coating machines (OSP)

Our production lines for the wet process section.

Copper Immersion

Copper Plating

Etching

Entek coating