Production Process

Our production process is mainly divided into the wet process section, photographic section, drill and route section, and finishing section. Our production lines are fully automated. For the wet process section, we have full automation for copper/gold plating, copper/gold immersion, etching, etc. Moreover, we have a chemical laboratory to test the chemical solutions from time to time. This is to ensure the top quality of the copper surface treatment during the plating process.

The PCB board surface treatments are

  • Nickel / Gold plating
  • Gold / Tin immersion
  • Hot air levelling (HAL)
  • Flux coating / Entek (OSP)
  • Carbon through holes
Process
Minimum line width (mm)
Minimum line spacing (mm)
Gold/Nickel plating
0.10
0.10
Other surface treatment (HSAL, OSP, Gold immersion, etc)
0.15
0.15
No of Layers
1-8